Gallu prosesu
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Gallu Gweithgynhyrchu PCB |
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Nghategori |
Heitemau |
Safonol |
Blaenswm |
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Sylfaenol |
Cyfrif haen pcb anhyblyg |
1-36L |
60L |
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Flex & Rigid - Cyfrif Haen PCB Flex |
PCB Flex: 1-10L |
PCB Flex: 1-16L |
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Anhyblyg - flex pcb: 2-20l |
Anhyblyg - flex pcb+hdi: 2-20l |
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Min. Trwch bwrdd fnished |
0.2 ± 0.05mm (8 ± 2mil) |
0.15 ± 0.025mm (6 ± 1mil) |
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Max. Trwch bwrdd fnished |
6.5 ± 10%mm (256 ± 10%mil) |
10.0 ± 10%mm (394 ± 10%mil) |
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Max.board/arae maint |
1060mm*610mm (41*24inch) |
1100mm*660mm (43*26inch) |
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Min. Trwch Craidd |
0.05mm (2mil) |
0.034mm (1.34mil) |
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Pentyrra ’ |
Trwy - twll pcb |
Ie |
Ie |
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Mecanyddol - yn ddall/claddu trwy PCB |
Ie |
Ie |
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Pcb sylfaen metel |
Ie |
Ie |
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Hdi |
1+N+1 |
Anhyblyg - flex pcb+hdi |
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1+1+N+1+1,2+N+2 |
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1+1+1+N+1+1+1,3+N+3 |
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Hanweddwr |
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Deunydd sylfaen |
TG arferol, TG canol, TG uchel |
Ie |
Ie |
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Plwm am ddim, heb halogen am ddim |
Ie |
Ie |
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Lamineiddio dk isel |
Ie |
Ie |
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Lamineiddio colled isel |
Ie |
Ie |
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Lamineiddio amledd uchel |
Ie |
Ie |
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Lamineiddio pi |
Ie |
Ie |
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Lamineiddio bt |
Ie |
Ie |
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Lamineiddio teflon |
Ie |
Ie |
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Cyflenwr materol |
Shengyi, Iteq, KB, Tuc, Grace |
Ie |
Ie |
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Isola, Ventec, Nanya, Dopont |
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Arlon, Rogers, Wangling, Taconic |
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Bergquist, Boyu, Nelco |
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Twll |
Min. Maint dril mecanyddol |
0.15mm (6mil) |
0.10mm (4mil) |
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Min. Maint dril laser |
0.10mm (4mil) |
0.075mm (3mil) |
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Drilio twll i gywirdeb twll |
± 0.05mm (± 2mil) |
± 0.05mm (± 2mil) |
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Goddefgarwch PTH |
± 0.075mm (± 3mil) |
± 0.05mm (± 2mil) |
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Goddefgarwch NPTH |
± 0.05mm (± 2mil) |
± 0.038mm (± 1.5mil) |
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Goddefgarwch drilio dyfnder rheoledig |
± 0.10mm (± 4mil) |
± 0.05mm (± 2mil) |
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Cymhareb agwedd PTH |
10:1 |
15:1 |
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Cymhareb agwedd laswer |
0.8:1 |
1:1 |
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Min. Pellter twll i'w olrhain |
7mil |
6.5mil |
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Olrhain, sodermask |
Min. Olrhain Lled/Gofod |
0.075mm/0.075mm (3/3mil) |
0.05mm/0.05mm (2/2mil) |
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Olrhain goddefgarwch lled |
± 10% |
± 8% |
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Min. Sylfaen cu trwch |
12um (1/3 oz) |
9um (1/4 oz) |
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Max. Sylfaen cu trwch |
12 oz |
12 oz |
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Goddefgarwch rheoli rhwystriant |
± 10% |
± 5% |
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Cofrestru ＜ 10l |
± 0.05mm (± 2mil) |
± 0.038 (± 1.5mil) |
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Cofrestru yn fwy na neu'n hafal i 10l |
± 0.075 (± 3mil) |
± 0.05 (± 2mil) |
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Min. Traw smt/qfp |
0.20mm (8mil) |
0.15mm (6mil) |
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Min. Traw bga |
0.23mm (9mil) |
0.20mm (8mil) |
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Min. Lled Pont Solder |
3mil |
3mil |
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S/M Goddefgarwch Cofrestru |
± 0.05mm (± 2mil) |
± 0.038mm (± 1.5mil) |
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Mecanyddol |
Goddefgarwch Llwybro |
± 0.13mm (± 5mil) |
± 0.10mm (± 4mil) |
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Goddefgarwch Punch |
± 0.10mm (± 4mil) |
± 0.05mm (± 2mil) |
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V - Torri goddefgarwch lleoliad |
± 0.10mm (± 4mil) |
± 0.075mm (± 3mil) |
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V - Torri goddefgarwch gweddilliol |
± 0.10mm (± 4mil) |
± 0.05mm (± 2mil) |
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Ongl a goddefgarwch beveling o g/f |
20 gradd /30 gradd /45 gradd, ± 5 gradd |
20 gradd /30 gradd /45 gradd, ± 5 gradd |
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Dyfnder a goddefgarwch beveling o g/f |
1.2 ± 0.20mm (47 ± 8mil) |
1.2 ± 0.10mm (47 ± 4mil) |
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Gorffen arwyneb |
Inc carbon |
Nipon |
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Mwgwd peelable |
Peter SD2955 |
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OSP |
Entek plus ht; Preflux f2 lx |
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Henigi |
Au: 0.03um -0.06um, ni: 3um -6um |
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Enig+osp |
Ie |
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Tun trochi |
0.8-1.2um |
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Arian trochi |
Ie |
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Hasl (am ddim) |
0.5-40um |
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Eneipg |
Au: 0.015-0.075um; PD: 0.02-0.075um; Ni: 2-6um |
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Electro. Aur caled |
Au: 0.125-1.270um; Ni: 2.50-6.25um |
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Proses arbennig |
Ymyl platd |
Ie |
Ie |
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Hanner twll |
Ie |
Ie |
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Twll ochr yn ochr |
Ie |
Ie |
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Trwy mewn pad |
Ie |
Ie |
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Dril cefn |
Ie |
Ie |
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Twll gwrth -finc |
Ie |
Ie |
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Uwch |
Cynhwysydd claddedig |
Ie |
Ie |
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Gwrthydd claddedig |
Ie |
Ie |
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Darn arian wedi'i ymgorffori |
Ie |
Ie |
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Anhyblyg - flex |
Ie |
Ie |
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Anhyblyg - flex + hdi |
Ie |
Ie |
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Swbanasoch |
Na |
Na |
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Anhyblyg - sylfaen flex + metel |
Na |
Na |
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